Measuring item and measuring method


The LEP Series of standard specification can automatically measure edge shape, wafer diameter, orientation flat length (in case of double orientation flat, orientation flat angle) and V-notch shape. 

In the LEP Series, sub-pixel detection method (measuring length in stricter precision than element sizes of the CCD image sensor and linear sensor) is applied for improving measurement resolution. 

By processing light intensity received by each element by computer, resolution as high as 1/16 (approx. 0.6um) of element size is achieved. 

Edges with different shapes can be treated by option software. 
 


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