Ÿ Bow/ Warp Measurement System SBW-330

ƒEƒF[ƒnƒTƒCƒY 300mm

‘ͺ’荀–Ϊ Bow,Warp,,GBIR.Thickness

ƒEƒF[ƒn”ΐ‘— Robot

Measures shape (thickness, bow, warp) of 300 mm silicon wafer by non-contact and non-destructive method.
Realizes automatic measurement of wafers in the cassettes supplied by the operator with one cassette stage and one wafer handling robot.
Built-in sample for self-calibration corrects temperature drift of the measuring instrument at any time required.
Built-in software calibrates the measurement values in accordance with customerfs standard measuring instrument.

ŸBow/ Warp Measurement System@SBW-330R

ƒEƒF[ƒnƒTƒCƒY 300mm

‘ͺ’荀–Ϊ Bow, Warp, ,GBIR, Thickness

ƒEƒF[ƒn”ΐ‘— Robot (with reversing mechanism)

Measures shape (thickness, bow, warp) of 300 mm silicon wafer by non-contact and non-destructive method.
Realizes automatic measurement of wafers in the cassettes supplied by the operator with one cassette stage and one wafer handling robot.
Built-in sample for self-calibration corrects temperature drift of the measuring instrument at any time required.
Built-in software calibrates the measurement values in accordance with customerfs standard measuring instrument.


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