[KOBELCO/LEO]Wafer Sorter

Slicing Process

300mm wafer sorter with Thickness and Bow/Warp measurement LBW-3030

300mm

Thickness, Bow/Warp

Robot

This system measures Thickness and Bow/Warp of the 300mm wafers after slicing, and classifies the wafers by the measurement results.

Polishing Process

300mm wafer sorter with Makyo and Bow/Wsrp measurement MBW-3030

300mm

Makyo, Thickness, Bow/Warp

Robot

This system measures Thickness and Bow/Warp, and the operator observes grinding marks by Makyo after wafer grinding. This system classifies the wafers by the measurement and observation results.

Grinding Process

200mm belt sorter with thickness measurement LTS-2200B

200mm

Thickness

Belt

This system measures the Thickness of 200mm wafers after slicing, and classifies the wafers by the results. This belt sorter is better adapted to rapid classification to a lot of class.

Incoming Process of Reclaim Wafer

Lot sorting system of 200mm wafer LRP-2420S

200mm

Thickness, PN, Resistivity

Robot

This system measures the Thickness, PN and Resistivity of 200 mm wafers and classifies them in incoming process of the reclaim wafer. This system can process maximum 1050 wafers at one time using 2 robots alternately for measurement and sorting.

Polishing Process

300mm wafer sorter with Resistivity and Bow/Warp measurement RPW-3080i

300mm

Thickness, Resistivity, PN,
Bow/Warp, Thickness, ID mark

Robot

This system measures 300mm wafers, read and check laser mark, and classifies them by the results.

Polishing Process

Wafer profile measurement system for 300mm wafer RPW-3030E

300mm

Thickness, Resistivity, PN, Bow/Warp,
GBIR, Diameter, ID mark

Robot

This system measures wafer profile and flatness of 300mm wafers,and classifies them after polishing process.

Outgoing Process

Laser mark inspection system for 200mm wafer LMC-2040F

200mm

ID mark

Robot

This system reads, checks the laser marks on the front and back surface of 200mm wafers, and classifies them in the outgoing process.

Polishing Process

Wafer edge and surface roughness measurement system for 300mm wafer LSM-3000

300mm

roughness

manual

This system is equipped with “Talysurf” of Taiyler Hobson Precision for roughness measurement unit.
This system measures the roughness of arbitrarily point on the edge or surface of 300mm wafers.

Outgoing Process

Wafer transfer system for 300mm wafer with load port LSS-3060FEi

300mm

ID mark

Robot

This system transfer the 300mm wafers from the cassette to the cassette based on ID marks and instruction from host computer.
This system is equipped with FOSB and FOUP load ports, and is adapted to mini-environment.

We have manufactured various sorting systems to customers. Please contact us.

TOP OF PAGE

Kobelco Research Institute, Inc. LEO Division
Sales(Tokyo)/9-12 Kita-Shinagawa, 5-Chome, Shinagawa-ku, TOKYO, 141-8688, JAPAN TEL(03)5739-6820 FAX(03)5739-6393
Sales(Kobe)/5-5 Takatsuka-dai, 1-Chome, Nishi-ku, Kobe, HYOGO, 651-2271, JAPAN TEL(078)992-2985 FAX(078)992-2990

This web site uses FlashPlayer. If not available, Plug-in must be downloaded.
Click the banner

Secondary use of the information, images, etc. provided by this web site is inhibited strictly such as copying, reprinting or selling without approval of the proprietor. Information (contents, images, etc.) in this server may be changed or stopped without prior notice