Ample non-contact, nondestructive sensors


Various non-contact, nondestructive sensors are prepared, based on accumulated abundant wafer evaluation technologies. 

Various types of sensors are arranged to optimum positions according to specifications and structures of the system, achieving the highest-precision measurement in the shortest time. 
 
Thickness, P/N, diameter sensor Thickness sensor
  Bow/warp sensor
Resistivity, P/N sensor






Thickness, P/N, resistivity sensor Thickness, P/N, resistivity sensor Low/high resistivity sensor
Sensor Measurement method Specifications
Makyo Optical  
GBIR Capacitive sensing Rotation Measurement
Roughness Coherence Correlation Interferometry Talysurf (Taylor Hobson Precision)
Resistivity
Low resistivity 
(Eddy-current)
Range:0.001 - 1ohmcm , Accuracy:0.2 - 0.8%
High resistivity
(Eddy-current)
Range:0.05 - 200ohmcm , Accuracy:0.5 - 2.0%
P/N type Contact 
(Thermal voltage)
Resistivity range:0.001 - 200ohmcm
Non-contact
(Rectification)
Resistivity range:0.1 - 200ohmcm
Thickness Capacitive sensing Accuracy:0.5um , Repeatability:0.1um
Resolution:0.01um
Diameter CCD image sensor Accuracy 25um , Resolution:14um
Bow/warp

Capacitive sensing

Distortion due to self mass is compensated.


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