Various non-contact,
nondestructive sensors are prepared, based on accumulated abundant wafer evaluation
technologies.
Various
types of sensors are arranged to optimum positions according to specifications
and structures of the system, achieving the highest-precision measurement in the
shortest time.
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|
|
Thickness,
P/N, diameter sensor |
Thickness
sensor
Bow/warp sensor |
Resistivity,
P/N sensor |
|
|
|
Thickness,
P/N, resistivity sensor |
Thickness,
P/N, resistivity sensor |
Low/high
resistivity sensor |
|