Al alloy for direct contact (DC) is directly stackable under transparency conductive electrode such as ITO and IZO without inserting Mo or Cr, realizing cost reduction, process reduction and capacity investment reduction. For this reason, utilization of this material is increasing. This material is applied to not only amorphous silicon TFT LCD but also LTPS LCD, OLED, and touch panel.

Comparison of schematic configurations in cross-sectional TFT

The simpler TFT structure using Al-alloys for DC makes some production steps, and hence production systems will be obsolete, and the production time will be reduced. Furthermore, the line edges of interconnects of our Al-alloys will be better controlled.

Comparison of sputtering systems

To fabricate conventional interconnection, since two or three intermediate layers are used, at least two kinds of sputtering targets are necessary. By contrast, to fabricate interconnections using Al-alloys for DC, only a single sputtering target is sufficient. The sputtering throughput also increases in the DC case.

Direct Contact (DC) alloy

DC	Direct contact aluminum alloy for general use such as LCD monitor
Advents DC	Low electivity direct contact aluminum alloy for large size TV
LTPS DC	Direct contact aluminum alloy for LTPS
Cu-DC	Cu-alloys realizing single material interconnection