Applications


Effective polishing
By unifying thickness of wafers set to the polisher, troubles such as cracking is prevented and unnecessary material removal is restricted. 

Sorting of shipping wafers
Sorting of shipping wafers according to wafer parameters such as resistivity, thickness, P/N type, diameter and bow/warp is easy.

Optimization of reclaim wafer process
By sorting wafers for reclaim into classes such as thickness, P/N type and bow/warp, the optimum process to reclaim wafers is selected. 

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Kobelco Research Institute, Inc. LEO Division
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