Wafer Bow/ Warp Measurement System SBW-330

Wafer Bow/ Warp Measurement System SBW-330
SpecificationSBW Series
objectsilicon single crystalline wafer, glass support
diameter100～450mm
MeasurementThickness、TTV、Bow/Warp
sensorcapacitive, optical sensor
thickness range700～1,000μm
accuracy±0.5µm
repeatabilityσ=0.1µm
display resolution0.01µm
duration4lines,2mm pitch:≦48sec/wafer
TSV/BSI process TOP

Kobelco Research Institute, Inc. LEO Division
Sales(Tokyo)/9-12 Kita-Shinagawa, 5-Chome, Shinagawa-ku, TOKYO, 141-8688, JAPAN [TEL]81-3-5739-6820 [FAX]81-3-5739-6393
Sales(Kobe)/5-5 Takatsuka-dai, 1-Chome, Nishi-ku, Kobe, HYOGO, 651-2271, JAPAN [TEL]81-78-992-2985 [FAX]81-78-992-2990
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