LEO Products applicable to
TSV and BSI Manufacturing Process

• Profile and thickness control of support glass and silicon wafer is indispensable for 3D process such as TSV and BSI device.
• Control of wafer grinder and polisher using monitor wafer is also important.
• Control of edge profile after bonding or grinding wafer is also important.
• We provide the equipments for these process control.

Kobelco Research Institute, Inc. LEO Division Sales(Tokyo)/9-12 Kita-Shinagawa, 5-Chome, Shinagawa-ku, TOKYO, 141-8688, JAPAN [TEL]81-3-5739-6820 [FAX]81-3-5739-6393 Sales(Kobe)/5-5 Takatsuka-dai, 1-Chome, Nishi-ku, Kobe, HYOGO, 651-2271, JAPAN [TEL]81-78-992-2985 [FAX]81-78-992-2990

This HP uses FlashPlayer. If not available, Plug-in must be downloaded. Click the banner

Secondary use of the information, images, etc. provided by this Home Page is inhibited strictly such as copying, reprinting or selling without approval of the proprietor. Information (contents, images, etc.) in this server may be changed or stopped without prior notice