Wafer Flatness Measurement System LGW-3020FE

Wafer Bow/ Warp Measurement System SBW-330
SpecificationLGW Series
objectsilicon single crystalline wafer , glass support
diameter200～300mm
Measurement Thickness, Bow/Warp, Flatness(GBIR, GFLR, GF3R, etc.)
sensorcapacitive, optical sensor
thickness range650～1,000μｍ
accuracy±0.5μm
repeatabilityσ=0.1μm
display resolution0.01μm
duration5mm pitch： ≦63sec/wafer
10mmpitch： ≦ 46sec/wafer
TSV/BSI process TOP

Kobelco Research Institute, Inc. LEO Division
Sales(Tokyo)/9-12 Kita-Shinagawa, 5-Chome, Shinagawa-ku, TOKYO, 141-8688, JAPAN [TEL]81-3-5739-6820 [FAX]81-3-5739-6393
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