SYSTEM

Flatness・profile Measurement System

Broadly used for optimization of wafer edge processing and inspection for shipping.

System detail
Edge/Notch Profile Measurement System

By our unique optical image processing technology, high precision edge/notch measurement is possible.

System detail
Makyo System

for control of wafer polishing process, delivery inspection and control of heat treatment products.

System detail
Bonding Evaluation・Edge Defect Inspection System

will detect defects such as fine scratches and cracks near the edge.

System detail
Sorting System・Transfer Machine

Any combination of measurement menu is available.

System detail
Lifetime Measuring System

Carrier recombination lifetime is measured with system.

System detail
Thin Film evaluation system for FPD

for valuation of the crystallinity of LTPS without contact and distruction.

System detail