Carrier recombination lifetime is measured with system.
for valuation of the crystallinity of LTPS without contact and distruction.
Broadly used for optimization of wafer edge processing and inspection for shipping.
for control of wafer polishing process, delivery inspection and control of heat treatment products.
By our unique optical image processing technology, high precision edge/notch measurement is possible.
Automatic measurement is posible for thickness, chamfer, width of the wafer edge and also the wafer diameter , length of orientation flat and notch shape.
Any combination of measurement menu is available.
will detect defects such as fine scratches and cracks near the edge.
Possible to measure with various menu