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Flatness・profile Measurement System
Broadly used for optimization of wafer edge processing and inspection for shipping.
System detail
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Edge/Notch Profile Measurement System
By our unique optical image processing technology, high precision edge/notch measurement is possible.
System detail
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Makyo System
for control of wafer polishing process, delivery inspection and control of heat treatment products.
System detail
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Bonding Evaluation・Edge Defect Inspection System
will detect defects such as fine scratches and cracks near the edge.
System detail
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Sorting System・Transfer Machine
Any combination of measurement menu is available.
System detail
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Lifetime Measuring System
Carrier recombination lifetime is measured with system.
System detail
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Thin Film evaluation system for FPD
for valuation of the crystallinity of LTPS without contact and distruction.
System detail