Carrier recombination lifetime is measured with system.
Thin Film evaluation system for FPD
for valuation of the crystallinity of LTPS without contact and distruction.
Flatness・profile Measurement System
Broadly used for optimization of wafer edge processing and inspection for shipping.
Makyo System
for control of wafer polishing process, delivery inspection and control of heat treatment products.
Edge/Notch Profile Measurement System
By our unique optical image processing technology, high precision edge/notch measurement is possible.
Edge Roll Off Measuring System
Automatic measurement is posible for thickness, chamfer, width of the wafer edge and also the wafer diameter , length of orientation flat and notch shape.
Sorting System・Transfer Machine
Any combination of measurement menu is available.
Bonding Evaluation・Edge Defect Inspection System
will detect defects such as fine scratches and cracks near the edge.