Bonding Evaluation・Edge Defect Inspection System

Bonding Evaluation Outline

Applying Kobelco Research Institute's existing Technology, it is possible to guide the user through the various  evaluation method for wafer bonding process such as TSV, BSI.

Evaluation Content

Center Displacement Measurement for Bonding Wafer

Principle

To measure Edge Shape, Notch Shape, Orientation Flat Length, and Wafer Diameter, the system is equipped with 3 independent optical sensor(edge sensor, notch sensor, external shape sensor) .Wafer is vacuum suctioned to a X-θ stage 、and will be able to move the measurement position to edge/notch sensor by translation（X）/rotation（θ）drive.Optical output signal will be transported to image memory. Image processing is performed by software  which is installed in the computer.When the image processing is performed, wafer edge, and orientation flat/notch shape is analyzed automatically and each parts length, angle and radius of curvature will be calculated.

notch deviation　Measurement  System 

Edge Defect Inspection System

System which can automatically detect  crack or chipping of the wafer edge .Defect detection of bonded wafer is also possible.Line-camera and Microscope can be selected according to the  application.

System Lineup

observation example （by microscope）