Measurement Service List

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Measurement Service List

  • Flatness/Profile Measurement

    Flatness: Si, SiC Sapphire substrate(Bow, Warp, TTV, GBIR, FSQR, and etc) flatness measurement.

    Flatness/Profile Measurement

    Flatness/Profile Measurement System Detail

    Measurement Example

    Example of saddle type profile

    Example of bowl type profile

  • Edge Profile Measurement

    Edge Profile: Si, SiC, Sapphire Substrate edge(bevel) profile measurement.

    Edge Profile Measurement

    Edge/Notch shape measuring system details

    Edge/Notch profile mearement example

    shows the measurement example of edge/notch profile.
    different profiles canbe supported using optional software.

    • dge profile measurement example(LCD display)
    • Edge profile measurement example(LCD display)
    • Edge 9 points display screen
  • Makyo Observation

    Makyo: Si Substrate(Mirror) surface observation

    Makyo Observation

    Makyo System Detail

    Si Wafer surface observation example

    Surface Roughness, Projection, Dent, Grinding Masks , Edge Crack, and Thermal Slip appears clearly

    • 面荒れ
      Orange Peel
    • 突起/凹み
      Dimple/Protuberance
    • 凹み
      Dimple
    • 研磨痕
      Polish Mark
    • 研磨痕
      Polish Mark
    • エッジクラック
      Edge Crack
    • スリップ転位
      Thermal Slip
    • スリップ転位
      Thermal Slip
    • 研削痕
      Grinding
  • Lifetime Measurement

    Lifetime measurment for Semiconductor materials such as Si,SiC, GaN, LTPS, and IGZO

    Lifetime Measurement

    Lifetime Measurement System detail

    Lifetime mapping example of bulk wafer

    Lifetime measurement for semiconductor materials such asn Si, SiC, GaN, LTPS, and IGZO. By measuring the lifetime, the heavy metal mixture of a wafers, the integrity of the crystals can be measured and also the wafer pollution cause may be detected.
    Standard Spec. pitch measurement of our Lifetime equipment is 0.5mm and with it high speed small mapping is possible.
    Blue figure represents short lifetime.

    • contamination by chucking
    • contamination by oxidation boat
    • OSF (Oxidation-induced Stacking Fault) ring
    • Pin contact from the manufacturing equipment
    • Slip Dslocation by thermal treatment
    • Absorption traces of vacuum tweezers

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